Package Fault Localisation
New Requirements for Advanced packages & Power Devices
Whereas Package Failure Analysis used to be limited to X-Ray inspection or Acoustic Microscopy (for Crack & Delamination), new technologies, for both advanced packages & power devices, have shown requirement for Fault Localisation prior getting to Physical Analysis.
Solution presented are ‘Non destructive » fault Localisation solutions
ELITE
Enhanced Lock-In Thermography Emission Through Package fault localisation
Elite Lite
Enhanced Lock-In Thermography Emission
Usecase: Flexible solution with ultimated sensitivity to detect hot spot through package (as well as flexible to silicon or power device application, advanced thermal analysis)
Pricinple: Lock-in Thermography support low power heat spot detection through package thanks to its unique InSb camera and optics together with its unique real time lock-in implementation.
Key Features: Unique high performance and Flexible implementation supporting multiple usecases.
Usecase: Flexible and simple solution with ultimated sensitivity to detect hot spot through package
Principle: Lock-in Thermography support low power heat spot detection through package thanks to its unique InSb camera and optics together with its unique real time lock-in implementation.
Key Features: Unique high performance and Flexible implementation.