Seiwa Optical Solutions

Advanced Optical Solutions for Semiconductor Applications

Overview

Seiwa Optical provides high-performance optical solutions for semiconductor failure analysis, inspection and imaging applications.

Its portfolio includes microscope objectives, infrared (IR) objectives, telecentric lenses, zoom lenses and advanced microscopy systems designed to deliver high resolution and sensitivity for demanding semiconductor applications.

High-performance optics are a critical component of semiconductor failure analysis and fault localization systems. Sector Technologies partners with Seiwa Optical to provide advanced optical solutions designed to improve imaging resolution, sensitivity and inspection capabilities.

A wide range of objective lenses and microscopy solutions is available to address different applications, wavelengths and system configurations, including frontside and backside semiconductor analysis.

Core Technologies

Optical & IR Objectives
High-performance M Plan APO, PE IR and PE IR Hi-Res objectives for visible and infrared semiconductor imaging applications.

Telecentric & Zoom Lenses
Precision optical solutions for inspection, measurement and imaging applications requiring high image quality and controlled magnification.

Microscopy Systems
Advanced microscopy solutions for frontside and backside inspection of semiconductor devices, supporting the analysis of cracks, contamination, lamination defects, electrical discharge damage and other device anomalies.

Core Optical Solutions

Seiwa Optical offers a range of high-performance infrared objectives and microscopy solutions designed for semiconductor inspection, imaging and failure analysis applications.

 

PE IR

Infrared Objectives for Semiconductor Imaging

High-performance IR objective lenses designed for backside semiconductor inspection and failure analysis applications.

  • Optimized for infrared imaging
  • High resolution and sensitivity
  • Multiple magnifications available 1x – 100X
  • Suitable for backside device analysis
  • Transmission 800nm – 1600nm

Datasheet

 

PE IR 2000

High-Resolution IR Objectives

Advanced infrared objectives designed for demanding high resolution semiconductor applications.

  • High-resolution IR imaging
  • Optimized optical performance
  • Designed for advanced semiconductor devices
  • Ideal for fault localization and backside analysis
  • 10X, 20X, 50X
  • Transmission 1000nm – 2000nm

Datasheet

IR Microscope

Infrared Microscopy Solutions

Advanced microscopy systems for frontside and backside inspection of semiconductor devices and materials.

  • Frontside and backside inspection
  • Visible and infrared imaging
  • Semiconductor defect inspection
  • Turret 5 positions
  • manual or motorized stage
  • auto focus
  • Powerful software
  • Stitching feature

Datasheet

Applications

Backside Semiconductor Imaging

  • Infrared imaging through silicon for the observation of internal device structures and features from the backside.

Failure Analysis & Fault Localization

  • High-resolution optical and infrared imaging to support defect investigation and fault localization workflows.

Frontside Device Inspection

  • Detailed optical inspection of semiconductor devices for the identification of cracks, contamination, surface defects and other physical anomalies.

Advanced Device Imaging

  • High-resolution imaging for advanced semiconductor devices where optical performance, resolution and sensitivity are critical.