Mechanical grinding and metrology solutions

As new generations of IC’s and other microelectronics move to smaller and smaller node sizes, there is a need for novel QA/QC, V&V, and reverse engineering techniques that can resolve device structure at an incredibly small scale. Varioscale products aims to meet the needs of new device analysis with a novel suite of tools and methods that push the boundaries of imaging and sample deprocessing capabilities. The VarioMill is uniquely suited for photoemission prep with its ability to automatically thin and measure parts down to less than 3 microns of remaining silicon thickness. VarioMetric utilizes an interferometric measurement system to determine the thickness of a sample in real time. Using this technique allows rapid measurement and characterization of a part, necessary in the fast paced environment of the semiconductor industry. The VarioMetric system preforming this measurement and analysis is included in all Varioscale products: VarioEdit, VarioMill and VarioMetric. This metrology system combines the ability to determine a wide range of thicknesses and robustness of measurements even on rough and highly doped samples to create a uniquely useful measurement system. The dual spectrometer system employed by all state-of-the-art Varioscale products pushes the measurement capabilities to its current specification of 1000 um down to 500 nm in a single system.