Meridian Waferscan

Real Yield Characterization onto wafer

 

 

 

With the stakes so high, the acquisition of meaningful statistical yield data is no game. Meridian WaferScan brings device analysis to an entirely new level with a comprehensive, high volume analytical approach to electrical fault localization. Whether your goal is the gathering of emission data or the application of the latest dynamic laser stimulation techniques, WaferScan brings the power of wafer-based data acquisition to your lab.

Waferscan Value

Incorporates all Meridian IV capabilities

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See below for Meridian IV values/ solutions

Rapid die-to-die indexing


Enabling Fast Failure Analysis - Good vs Bad dies comparison -  and Yield binning through Emission signatures

Dynamic fault coverage with high speed ATE interface

Fully compatible with NEXS Software Suite (and most popular 3rd party EDA applications

Incorporating Meridian advanced Analysis solutions

Patented, industry-proven "Point & Click" Solid Immersion Lens ( SIL)

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Solid Immersion Lens enables highest optical resolution (up to 250nm) & sensitivity – thanks to highest NA. Resolution is required to differentiate sub-100nm modules. Meridian IV “Point & Click” is an unique solution allowing practical navigation with the SIL.

Best-in-class InGaAs-based emission detection


Optional High performance L1K InGaAs camera  available on Meridian IV, very low noise, with direct optic path enable to maximize sensitivity for the Photo Emission Microscopy

High sensitive LSM solution with Lock-in

Allowing very high sensitivity on all statics laser based techniques

LVI and CW- LVP enable to extend EFA usecase toward design debug / time analysis

Beyond Fast Failure Analysis

Using Photoemission, laser technologies and frequency mapping to enable good & bad die comparision, to identify design marginalities


Photon Emission Microscopy ( PEM) on the Meridian platform is based on an optimized combination of a high sensitivity short-wave infrared (SWIR) InGaAs camera and high numerical aperture (NA) aberration corrected optics. This combination provides high resolution through-silicon imaging and low-signal photon detection over the 0.9 to 1.6um spectral range, a capability particularly useful for backside device analysis. This optimized low-noise, high-sensitivity configuration enables emission acquisitions with unmatched signal-to-noise ratios resulting in rapid, transistor-level fault detection, even on sub-1 volt devices.

 

The Laser Scanning Microscope (LSM) option transforms the Meridian into a high-resolution, high-contrast confocal laser scanning system optimized for both static and dynamic failure analysis. Static Laser Stimulation ( SLS) applications such as OBIRCH, OBIC, and Seebeck Effect Imaging ( SEI) identify the sources of shorts and resistive defects, providing the perfect complement to emission-based techniques.

laserParametric defects are uncovered only when the failing device is operated under a specific set of operations parameters - typically a combination of voltage, clock speed, and temperature. Implementing strong detection technology coupled with a set of advanced analytical methodologies allows for the introduction of new, dynamic applications such as Logic State Mapping (LoSM) and Dynamic Laser Stimulation ( DLS). Meridian facilitates the development of the most advanced dynamic applications and techniques while maintaining the capability to isolate static faults.

 

 

Modulation Mapping corresponds to the ability to achieve Laser Voltage Imaging (LVI) or Continuous Wave Laser Voltage Probing (CW-CLP). The LVx option is available on  the Meridian platform  (avec well as the Emiscope and Ruby platform). This modulation mapping aims to visualize all functional areas at a given frequency (modulation). Such imaging technique has proven to be a unique solution for broken scan chain debug.

 

Die to Die real indexing

 

Waferscan ability for probing, nagigating automatically through multiple dies, using SIL (Solid Immersion Lense) on wafer – bring multi-dies inspection capabilities.

 

 

 

 

 

 

 


Meridian Waferscan is a FEI EFA group solution

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ü LVI and CW-LVP enable to extend EFA usecase toward design debug / time analysis

Die to Die real indexing

Waferscan ability for probing, nagigating automatically through multiple dies, using SIL (Solid Immersion Lense) on wafer – bring multi-dies inspection capabilities.



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