VARIOEDIT

Silicon Access solution

Fast & Clean Access for your backside analysis

 

 

 

 

 

Unique LACE (Laser Assisted Chemical Etching) solution

VarioEdit is a Laser Assisted Chemical Etching (LACE) system pioneered for backside circuit edit, laser chemical vapor deposition (LCVD) and laser assisted dielectric deposition.

Improving FIB success Rate & Time to result to the FIB

Applications are numerous such as very fast backside silicon etching, 3-D micromachining of semiconductor and biomaterial devices, Deposition of metal lines and pads.

 

LACE adds capability and capacity to the Backside Circuit Edit Tool Set

  • Can work from full thickness down

    • CNC milling not required

    • Device attached to PCB or has front side capacitors

  • Robust to surface contamination

  • Low cost of ownership

LACE brings its advantages to any Silicon based devices

  • Clean Silicon removal by vaporization: silicon opening without any artifacts linked to sputtered material.
  • Deposition of low resistive long metal lines for package

Efficient Technology

  • Etch very flat and smooth trenches within a few micrometers of the circuit layers
  • Localized trenching is the best method for preserving the electrical, thermal and mechanical integrity of the IC
  • Throughput Value
    • Silicon etching 50X faster than chemically assisted (XeF2), high current FIB
    • “off loading” the FIB for higher value processing
    • Platinum deposition of long lines and pads with no overspray


The VarioEdit system is primarily constructed with three building blocks:

  • Optical Block—includes a high power laser, beam steering optics and optomechanical components, viewing system and an in-situ thickness monitoring metrology tool.
  • Process Chamber—includes sample holder and gas/vacuum handling equipment/fittings
  • Precision X-Y-Z stages

 

 


VarioEdit is a Varioscale solution varioscale

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* Can work from full thickness down

o CNC milling not required

o Device attached to PCB or has front side capacitors

*
Robust to surface contamination

* Low cost of ownership



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