{"id":2798,"date":"2026-05-06T09:07:11","date_gmt":"2026-05-06T07:07:11","guid":{"rendered":"https:\/\/sector-technologies.com\/?page_id=2798"},"modified":"2026-09-01T19:49:15","modified_gmt":"2026-09-01T17:49:15","slug":"dynamic-fa","status":"publish","type":"page","link":"https:\/\/sector-technologies.com\/index.php\/dynamic-fa\/","title":{"rendered":"Dynamic FA"},"content":{"rendered":"<p><img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"707\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-0bis.png\" alt=\"\" srcset=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-0bis.png 939w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-0bis-300x265.png 300w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-0bis-768x679.png 768w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<h2>\n<p align=\"center\" style=\"text-align:left\"><b><u>Dynamic FA &amp; Design Debug<\/u><\/b><\/p>\n<\/h2>\n<p><strong><em>Dynamic analysis using Laser and Ebeam based real time transistor waveform acquisition<\/em><\/strong><\/p>\n<p style=\"text-align: justify;\"><strong>Overview<\/strong><\/p>\n<p style=\"text-align: justify;\">The capacity to enhance yield and reliability relies on thorough defect analysis. Debugging marginal failures at the design level can be particularly difficult, as they often stem from voltage or timing issues within the device. Identifying the root cause of a parametric failure requires pinpointing its exact location inside the device and accessing the relevant circuitry without causing damage or concealing the defects.<\/p>\n<p><strong>Core Technologies<\/strong><\/p>\n<p>Near Infrared, Visible Lasers and EBeam based techniques are available to extract activity information from an emulated device at transistor level.<\/p>\n<p>Applicable from legacy CMOS technologies down to advance FinFET.<\/p>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"662\" height=\"270\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-1.png\" alt=\"\" srcset=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-1.png 662w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-1-300x122.png 300w\" sizes=\"(max-width: 662px) 100vw, 662px\" \/><br \/>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"388\" height=\"439\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-2.png\" alt=\"\" srcset=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-2.png 388w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Design-debug-picture-2-265x300.png 265w\" sizes=\"(max-width: 388px) 100vw, 388px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<h2>\n<p><b>Solutions<\/b><\/p>\n<p>The Meridian Product line covers from NIR, Visible down to EBeam Dynamic EFA applications, depending on customer resolution requirements. Probing is doable from 10\u2019s of kHz up to GHz capability. CAD link (NEXS\/Avalon) is available for probing location registration .<\/b><\/p>\n<\/p>\n<\/h2>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"200\" height=\"171\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Meridian-sans-BKG.png\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p style=\"text-align: center;\"><strong>Meridian IV<\/strong><\/p>\n<ul>\n<li>\n<h6>EMMI\/LSM system with all static and Dynamic EFA techniques<\/h6>\n<\/li>\n<li>\n<h6>NIR Laser Voltage Imaging and Probing (LVI\/LVP)<\/h6>\n<\/li>\n<li>\n<h6>Targeted for technology down to 22nm<\/h6>\n<\/li>\n<li>\n<h6>Resolution down to 220nm<\/h6>\n<\/li>\n<li>\n<h6><a href=\"https:\/\/documents.thermofisher.com\/TFS-Assets\/MSD\/Datasheets\/nProber-IV-datasheet.pdf\" target=\"_blank\" rel=\"noopener\">Datasheet<\/a><\/h6>\n<\/li>\n<\/ul>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/02\/Meridian-EX-1024x1024.png\" alt=\"\" srcset=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/02\/Meridian-EX-1024x1024.png 1024w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/02\/Meridian-EX-300x300.png 300w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/02\/Meridian-EX-150x150.png 150w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/02\/Meridian-EX-768x767.png 768w, https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/02\/Meridian-EX.png 1420w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p style=\"text-align: center;\"><strong>Meridian EX<\/strong><\/p>\n<p>EBeam based system with Dynamic EFA Analysis and design Debug Capabilities<\/p>\n<p>EBeam Voltage Imaging and Probing (EVI\/EVP)<\/p>\n<p>Targeted for technology below 7nm<\/p>\n<p>Resolution down to 20nm<\/p>\n<p><a href=\"https:\/\/www.thermofisher.com\/us\/en\/home\/electron-microscopy\/products\/electrical-failure-analysis-systems\/hyperion-ii.html\" target=\"_blank\" rel=\"noopener\">Datasheet<\/a><\/p>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"200\" height=\"171\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Meridian-sans-BKG.png\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p style=\"text-align: center;\"><strong style=\"color: #000000;\">Meridian 7<\/strong><\/p>\n<p>LSM based system with both NIR and Visible laser sources<\/p>\n<p>Suited for Dynamic EFA Analysis and design Debug<\/p>\n<p>NIR &amp; Visible (785nm) Laser Voltage Imaging and Probing (LVI\/LVP)<\/p>\n<p>Targeted for technology down to 7nm<\/p>\n<p>Resolution down to 140nm<\/p>\n<h2>\n<p><b>Dynamic analysis applications<\/b><\/p>\n<\/h2>\n<p>Dynamic analysis enable multiple range of applications<\/p>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"178\" height=\"96\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Dynamic-Application-FA.jpg\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p><strong>Failure Analysis<\/strong><\/p>\n<ul>\n<li>Broken scan chain debug<\/li>\n<li>Transition failure<\/li>\n<li>ATPG Failure Isolation Support<\/li>\n<li>Dynamic related Failures<\/li>\n<\/ul>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"186\" height=\"96\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Dynamic-application-Design-Debug.jpg\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p><strong>Design Debug &amp; validation<\/strong><\/p>\n<ul>\n<li>First silicon debug and validation<\/li>\n<li>Design related failure<\/li>\n<\/ul>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"195\" height=\"96\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/dynamic-application-Techno-Dev.jpg\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p><strong>Technology development &amp; support<\/strong><\/p>\n<ul>\n<li>Yield ramp up<\/li>\n<li>Yield optimization<\/li>\n<\/ul>\n<p>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"192\" height=\"96\" src=\"https:\/\/sector-technologies.com\/wp-content\/uploads\/2026\/05\/Dynamic-Application-HW-security.jpg\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n<p><strong>Hardware security<\/strong><\/p>\n<ul>\n<li>Functional Block identification<\/li>\n<li>Data bit extraction<\/li>\n<li>Data alteration<\/li>\n<li>Data reading<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Dynamic FA &amp; Design Debug Dynamic analysis using Laser and Ebeam based real time transistor waveform acquisition Overview The capacity to enhance yield and reliability relies on thorough defect analysis. Debugging marginal failures at the design level can be particularly difficult, as they often stem from voltage or timing issues within the device. Identifying the [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2798","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v18.2.1 (Yoast SEO v26.6) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Dynamic FA - Sector-Technologies<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/sector-technologies.com\/index.php\/dynamic-fa\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Dynamic FA\" \/>\n<meta property=\"og:description\" content=\"Dynamic FA &amp; Design Debug Dynamic analysis using Laser and Ebeam based real time transistor waveform acquisition Overview The capacity to enhance yield and reliability relies on thorough defect analysis. 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