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Term Definition
ATE

Automatic Test Equipment Any machine which performs tests automatically.

ATPG

ATPG (acronym for both Automatic Test Pattern Generation and Automatic Test Pattern Generator) is an electronic design automation method/technology used to find an input (or test) sequence that, when applied to a digital circuit, enables testers to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.

Back-End (BE)

In the semiconductor industry, Back End corresponds to the second phase of manufacturing during which the silicon chip is mounted in a package designed (assembly) not only to protect it, but also to provide external connections via a series of very fine wires, followed by testing, assembling, finishing and packing. Note: this is different from BEOL expression

BEOL

Back-End Of Line - group of all steps in the semiconductor fab after contact, including all metal layer, up to the PADS creation. Note: not to confused with the general term "Back-End (BE)" referencing to the packaging, BEOL is actually part of the "Front-End (FE)" phase of semiconductor manufacturing

CAD

Computer Aided Design Software and hardware tools that allow graphic design. It assists in the design of a product and in the verification of its performance by simulation.

CW-LVP

Continuous Wave Laser Voltage Probing - is a specific LVP solution

DFT

Design for Test (aka "Design for Testability" or "DFT") is a name for design techniques that add certain testability features to a microelectronic hardware product design. It is used both for production validation as for design debug. It is translating in practice in introducing "scan chain"

DLS

Dynamic Laser Stimulation- Group of techniques using LSM technology, based on Dynamic stimulation of the device, i.e. running test sequence.

DUT

Device Under Test - name used for device being characterized in Electrical Failure Analysis

EBAC

Electron Beam Absorbed Current

EBIC

Electron Beam Induced Current (EBIC) is a semiconductor analysis technique performed in a scanning electron microscope (SEM).EBIC is performed by measuring the induced current from e-Beam stimulation. NanoProbing solution in SEM enable such solution

EFA

Electrical Failure Analysis - part of the Global Fault Isolation - aiming to identify fault localization on chip from electrical simulation of the device

EMMI

Emission Microscopy - Technique used in Electrical Failure Analysis - Other name can be seen: PEM, Photo Emission Microscopy

ESD

ElectroStatic Discharge

FEOL

Front-End Of Line - group of all steps in the semiconductor fab from bare silicon till completion of the gates - prior to all metal line (being BEOL steps).

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